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Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT
A study in flip-chip UBM/bump reliability with effects of SnPb
Effect of Under Bump Metallization (UBM) Quality on Long Term
Effect of Under Bump Metallization (UBM) Quality on Long Term
Schematics of bump metallization for three TVs.
Simulation of current distribution in the solder bump: ͑ a ͒ Solder
Coatings, Free Full-Text
Cu/Ni interface study for bump reliability improvement
Effects of UBM structure/material on the reliability performance
Mixed mode cracking in a thermally cycled BGA. The interfacial
Schematic structures of the cross-section of the indium bump just
Effect of Under Bump Metallization (UBM) Quality on Long Term