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Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

4.7 (84) · $ 7.50 · In stock

Metal-graphene interfaces in epitaxial and bulk systems: A review - ScienceDirect

Hierarchical Design in LiMn2O4 Particles for Advanced Hybrid Aqueous Batteries

Electrodeposition and characterization of copper nanocone structures

Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Metal-graphene interfaces in epitaxial and bulk systems: A review - ScienceDirect

蕴雯 WU, Waseda University, Tokyo, Sōdai, Department of Applied Chemistry

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

Huiqin LING, Shanghai Jiao Tong University, Shanghai, SJTU, State Key Laboratory of Metal Matrix Composites